It’s not just movies, televisions and video games that are going three-dimensional these days. Microchips are doing it, too. Semiconductors aren’t shifting into the third dimension because it’s fashionable, though. This shift is about continuing Moore’s Law, the relentless drive for higher performance that has driven the industry for four decades.
With three very different types of 3D construction in development today, it can be a confusing subject. Vertical chip structures, 3D device stacking, 3D chip packaging — what does it all mean? Hopefully this video will help to demystify the subject.
Post time: Nov-05-2017